back side of a eFOSB front opening shipping box filled with 300 mm semiconductor wafers
Information video about the features of a eFOSB for 300 mm wafers
Front side of a front opening shipping box for 300 mm semiconductor wafers
Back side of a empty eFOSB front opening shipping box for 300 mm semiconductor wafers
Door of a eFOSB front opening shipping box
Close up of semiconductor wafers placed in the eFOSB front opening shipping box
back side of a eFOSB front opening shipping box filled with 300 mm semiconductor wafers
Information video about the features of a eFOSB for 300 mm wafers
Front side of a front opening shipping box for 300 mm semiconductor wafers
Back side of a empty eFOSB front opening shipping box for 300 mm semiconductor wafers
Door of a eFOSB front opening shipping box
Close up of semiconductor wafers placed in the eFOSB front opening shipping box
back side of a eFOSB front opening shipping box filled with 300 mm semiconductor wafers
Information video about the features of a eFOSB for 300 mm wafers
Front side of a front opening shipping box for 300 mm semiconductor wafers
Back side of a empty eFOSB front opening shipping box for 300 mm semiconductor wafers
Door of a eFOSB front opening shipping box
Close up of semiconductor wafers placed in the eFOSB front opening shipping box
eFOSB

eFOSB Front opening shipping box - 300 mm

eWB0531-A-ASSY-3-HFI-W

  • SEMI/FIMS compliant
  • Features 25 slots at 10mm pitch
  • Manual opening and closing
  • Ultrapure, low outgassing materials to protect wafers

The Front Opening Shipping Box (FOSB) is a specialized container designed to protect semiconductor wafers during transport, storage, and handling. Used throughout the manufacturing process, it keeps wafers free from contamination, vibration, and physical damage, ensuring consistent quality and yield.

ePAK’s advanced eFOSB builds on this technology with enhanced sealing, strength, and compatibility for automated handling systems. It’s ideal for every stage of wafer production; from fabrication and testing to assembly, packaging, and international shipping, maintaining wafer integrity under the most demanding conditions.

These carriers provide a clean, secure, and standardized solution for 300 mm wafers, reducing manufacturing risks and improving operational efficiency. As the industry evolves, eFOSB technology continues to advance, offering smarter tracking, greater capacity, and improved protection for next-generation semiconductor materials.

Color: Transparant
Slots: 25
Wafer Size: 300 mm (12")
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