Modular eFOUP Front opening unified pod system

The Modular Front-Opening Unified Pod (eFOUP) by ePAK is a specialized container used in semiconductor manufacturing to safely store and transport 200 or 300 mm silicon wafers and flex frames. The eFOUP is designed to provide maximum protection during every step of the production process.

The eFOUP supports 6 different inserts that are permanently installed, which makes the eFOUP capable to hold 13 or 25 wafers of 200 or 300 mm or 25 film frames of 276 mm. The eFOUP is also available with a molded insert specifically designed to safely transport probe card by preventing vibrations and mechanical contact damage.

The eFOUP ensures wafers stay free from contaminants, physical damage, and electrostatic discharge, all factors that could reduce product quality or yield. By maintaining a clean and secure environment, it helps manufacturers produce more reliable chips with higher efficiency.

A key advantage of the eFOUP is its front-opening design, which works perfectly with automated material handling systems (AMHS) and robotic process equipment. This design allows precise, hands-free wafer transfers, greatly reducing human contact, preventing contamination, and minimizing mechanical damage.

In short, the modular ePAK eFOUP combines protection, precision, and productivity, making it an essential tool for advanced semiconductor manufacturing.

For more information about the modular eFOUP you can view the datasheet or reach out to our team!