Information video of a eFOUP front opening unified pod

Front view empty eFOUP without the door.

Close-up of slot design inside the eFOUP

Bottom view of eFOUP with 2 N2 purge points

eFOUP

Standard eFOUP Front opening unified pod 300 mm

eWB0685-ASSY-1

Wafer carrier for 300 mm wafers
SEMI/FIMS compliant
Holds capacity for 25 wafers
Multiple options available for purge points, windows and handles
Reduced particle generation due to robust wafer retention
Modular model available with 13/25 slot option for 200/300 mm wafers

A FOUP (Front Opening Unified Pod) is a sealed wafer carrier designed for 300 mm semiconductor wafers, engineered to the SEMI E47.1 standard. The eFOUP holds up to 25 wafers in an ISO Class 1 micro-environment, protecting them from particle contamination during automated transport between process tools in the fab. Its front-opening mechanism interfaces directly with load ports and AMHS systems.

The ePAK 300 mm wafer foup ensures wafers stay free from contaminants, physical damage, and electrostatic discharge, all factors that could reduce product quality or yield. By maintaining a clean and secure environment, it helps manufacturers produce more reliable chips with higher efficiency.

A key advantage of the eFOUP is its front-opening design, which works perfectly with automated material handling systems (AMHS) and robotic process equipment. This design allows precise, hands-free wafer transfers, greatly reducing human contact, preventing contamination, and minimizing mechanical damage.

In short, the ePAK eFOUP combines protection, precision, and productivity, making it an essential tool for advanced semiconductor manufacturing.